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Wish Formula Bubble Peeling Pad
C200 Bubble Peeling Pad Wish Formula
Wish Formula Bubble Peeling Pad
bubble pad face
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C200 Bubble Peeling Pad

Wish Formula
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Size: 16ml

This patented exfoliating pad from Wish Formula has natural AHA ingredients and natural extracts to effectively remove skin impurities, dead skin cells and sebum. 200mg of pure Vitamin C and Fermented Botanical Extracts deeply absorb into the resurfaced skin.


Suitable for all skin types, apart from those sensitive to vitamin C. Each pack contains 1 pad.


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How to use

Tear open the sachet and take out the pad. Dampen the pad with water and create rich bubbles by squeezing it in your hand. Gently massage your face in circular motions with the fibre side for 2 to 3 minutes, avoiding the eyes and lips.  Then flip the pad over and gently pat the vitamins into the skin using the softer side. Rinse off the foam with water, follow with your toner and the rest of your Korean Skincare Routine. After use, ensure you apply SPF if you're out and about during the day.


Water, Disodium Cocoamphodiacetate, Potassium Cocoyl Glycinate, Cocamidopropyl Betaine, Cocamide DEA, Lactic Acid, Glycolic Acid, Glycerin, Dipropylene Glycol, Ascorbic Acid, Lactobacillus/Olive Leaf Ferment Extract, Saccharomyces/Peppermint Leaf Ferment Filtrate, Lactobacillus/Clover Flower Ferment Extract, Hyaluronic Acid, Polyglutamic Acid, Apium Graveolens (Celery) Extract, Brassica Oleracea Capitata (Cabbage) Leaf Extract, Oryza Sativa (Rice) Extract, Solanum Lycopersicum (Tomato) Fruit/leaf/stem Extract, Brassica Rapa (Turnip) Leaf Extract, Daucus Carota Sativa (Carrot) Root Extract, Brassica Oleracea Italica (Broccoli) Extract, Arginine, Aloe Barbadensis Leaf Juice Powder, DMDM Hydantoin


   The experts say: “The C200 bubble exfoliation pad is so much fun to use! The Vitamin C and Rice Extracts leave my skin is so bright and glowing. Use a moisturising or repairing facial mask after usage for maximum effect.”


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